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Open nowPosted 2 days ago

R&D Process Engineer (Die-to-Wafer)

MyCareersFuture94,028 open roles

Pay
SGD 4,000 – SGD 6,000 a month
Where
North, Singapore
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Your applicationOpen nowR&D Process Engineer (Die-to-Wafer)MyCareersFuture · North, Singapore

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  2. 3.4%3 days
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  4. 14.2%14 days
  5. 34.1%30 days
This job: posted 2 days ago

The posting

About the role

Develop, optimize, and qualify Die-to-Wafer (D2W) processes, including Flipchip and Underfill, for advanced semiconductor packaging applications. Support process readiness, yield improvement, process robustness, and customer-specific technical solutions from development through NPI. Establish and maintain R&D process flows, recipes, instructions, and device information in MES to support engineering and qualification builds.

Key responsibilities

  • Develop and qualify D2W processes, including Flipchip and Underfill, for advanced packaging applications such as 2.5D, Fan-In, and Fan-Out
  • Perform hands-on process setup, DOE, optimization, characterization, and continuous improvement using statistical tools such as JMP
  • Support process and yield improvement to achieve robust and scalable manufacturing processes
  • Develop and review FMEA, OCAP and Control Plans to identify and mitigate process risks
  • Create and maintain MES process flows, recipes, process instructions, BOM, and device information for R&D builds
  • Support process monitoring and reporting, including staging-time and yield monitoring, to facilitate transition to NPI
  • Collaborate with NPI, Operations, Quality and Equipment teams to support process qualification, technology transfer and manufacturing readiness

About you

  • Bachelor's degree in Engineering (Mechanical, Materials, Electronics, or related disciplines)
  • 3–5 years of hands-on semiconductor process engineering experience preferred
  • Experience in Die-to-Wafer, Flip Chip, Underfill, die attach, or advanced packaging processes is an advantage
  • Strong problem-solving and analytical skills
  • Good communication skills with the ability to work effectively with cross-functional teams
  • Ability to work independently and manage multiple engineering activities in a fast-paced semiconductor environment
  • Fresh Engineering Graduates with strong interest in semiconductor process development are welcome to apply
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