The posting
R&D - Lithography R&D - Underfill / Cure R&D - Plating, PR Strip, Wet Etch R&D - CA & TCB
Responsibilities:
- To design, qualify, and optimize advanced processes that meet strict design rules and high-density packaging requirements, ensuring stable, cost-effective, and scalable technology delivery according to the technology roadmap.
- Lead assigned projects.
- Yield Improvement & Yield Failure Analysis (FA)
- Technology Qualification & Transfer
- Equipment & Material Evaluation
Requirements:
- Bachelor’s degree or higher in engineering disciplines such as Materials Science, Mechanical Engineering, Chemical Engineering, Electronics, or Advanced Materials
- R&D or mass production experience of at least three years in processes
- Proficiency in data analysis tools (e.g., JMP, MATLAB, Excel)
- Strong analytical and problem-solving skills
- Strong skills in experimental design (DoE), failure analysis (FA), and technical data reporting
- Experience in customer-driven development programs, customer qualification, and technical issue resolution for semiconductor packaging solutions.



