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Open nowPosted 2 days ago

R&D Singulation/Dicing Process Engineer

MyCareersFuture94,028 open roles

Pay
SGD 4,000 – SGD 6,000 a month
Where
North, Singapore
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Your applicationOpen nowR&D Singulation/Dicing Process EngineerMyCareersFuture · North, Singapore

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  4. 14.2%14 days
  5. 34.1%30 days
This job: posted 2 days ago

The posting

About the role

Develop, optimize, and stabilize wafer/package separation processes, including Laser Grooving, Stealth Dicing, Blade Dicing, and Molded Wafer Singulation, for advanced semiconductor packaging. Drive process readiness, yield improvement, robustness, and customer-specific technical solutions toward production.

Key responsibilities

  • Develop and qualify separation processes for 2.5D, Fan-In, Fan-Out, and eBar technologies
  • Lead DOE, process optimization, characterization, and continuous improvement using statistical tools such as JMP
  • Perform hands-on process setup and optimization of Laser Groove, Stealth Dicing, and Blade Dicing equipment
  • Drive process validation, yield stabilization, troubleshooting, and root-cause analysis
  • Develop/review FMEA, OCAP, and Control Plans to mitigate process risks and support LVM readiness
  • Provide technical support for customer programs, including feasibility evaluation and issue resolution
  • Collaborate with cross-functional teams including R&D, Process Engineering, Equipment, Quality, and Operations to drive process qualification, technology transfer, and manufacturing readiness

About you

  • Bachelor's degree in Engineering (Mechanical/Materials/Electronics)
  • 3-5 years of hands-on experience in process engineering in semiconductor manufacturing
  • Fundamental understanding of advanced semiconductor fabrication and integration processes
  • Proficiency in preparing technical documentation and delivering presentations
  • Experience in Si Photonics applications, backgrinding, CMP, and planarization is an added advantage
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