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Open nowPosted 14 days ago

Senior Engineer/ Engineer - Thin Film CMP Equipment

MyCareersFuture94,028 open roles

Pay
SGD 4,200 – SGD 6,600 a month
Where
East, Singapore
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Your applicationOpen nowSenior Engineer/ Engineer - Thin Film CMP EquipmentMyCareersFuture · East, Singapore

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The clock on this job

Early applications get read.

7.7% of postings close within 7 days. Measured by our own scanner across the market.

Share of postings closed within
  1. 1.6%1 day
  2. 3.3%3 days
  3. 7.7%7 days
  4. 14.0%14 days
  5. 33.7%30 days
This job: posted 14 days ago

The posting

Job Description:

  • To own, maintain and improve the following indices: Quality, Uptime and Cost.
  • Sustain equipment KPI and make continuous improvements to enhance the performance.
  • Monitor and control equipment performance indices. Optimize PM procedures to make it more effective and efficient.
  • Coordinate with both process and Manufacturing Engineers to ensure work is carried out efficiently to meet module objectives.
  • Manage the logistics for parts so as to prevent prolonged uptime losses in the case of equipment failure.
  • Manage the expenditure allocated for equipment maintenance without compromising on quality output.
  • Continuous improvement of equipment KPI in terms of quality, uptime and costs.
  • Plan and implement an effective Preventive Maintenance program on equipment.
  • Coach and Mentor subordinates to ensure that skill level and knowledge are up to date, and continuously give feedback on their work performance.
  • Document Corrective Action and Best Known Methods, and Fan it out to all for maximum ROI and learning.
  • Participate in CIP programs to optimize equipment utilization and cost of maintenance.
  • Become the technical Expert for the respective machine specialization.
  • Know how to use SPACE to monitor and analyze SPC charts. Know how to use JMP to analyze engineering experiments.
  • Know how to use measurement instruments effectively in data collection.
  • Understand FMEA and be able to generate FMEA analysis for new tool. Able to utilize it to identify tool weaknesses and derive the top 3 to 5 risk factors.
  • Able to create PROMIS (SiView) DC OP and SPC charts.
  • Coordinate new equipment start-up to support production, from facilities hookup, vendor startup, to acceptance of equipment for production.
  • Wafer scrap reduction awareness and mindset.
  • Follow up on SPSR, MRB, 8D, TECN, and ECN documentation for closure of issues / events. Provide guidance to Junior Engineers.
  • Self audit and update specifications to meet TS16949 Quality Standard requirements.
  • Set Expectation and carry out performance appraisal for Technician or AE as instructed by Section Manager.

Requirements:

  • Degree in Electrical / Electronics / Mechanical / Mechatronics / Microelectronics Engineering
  • Min 3 years of relevant work experience in Thin Film CMP Equipment.
  • An excellent team player with good interpersonal, communication and written skills
  • Strong logical thinking capability and good analytical skill
  • High level of integrity with strong leadership attributes to lead and coach a team
  • Highly committed with good ownership and accountability
  • Able to adapt in a fast pace environment and work under pressure
  • Proficient in MS Office Applications
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