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Open nowPosted 15 days ago

Senior Engineer/Engineer (Thin Film - CMP Process)

MyCareersFuture94,028 open roles

Pay
SGD 4,200 – SGD 6,500 a month
Where
East, Singapore
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Your applicationOpen nowSenior Engineer/Engineer (Thin Film - CMP Process)MyCareersFuture · East, Singapore

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The clock on this job

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15.1% of postings close within 7 days. Measured by our own scanner across the market.

Share of postings closed within
  1. 2.4%1 day
  2. 6.5%3 days
  3. 15.1%7 days
This job: posted 15 days ago

The posting

Job Responsibilities:

  • Analyze SPC charts using SPACE. Know all the PR rules and their significance. Do proper annotation to maintain quality troubleshooting rate for SPC OOC. Understand Cp and Cpk indices.
  • Analyze split lot, DOE data, ET, sort yield using JMP, Klarity ACE.
  • Create SPC charts, DCOP and modify SLDB using PROMIS (Si-View).
  • Upload recipe, check recipe and ensure recipe content compliance using RMS.
  • Follow up on SPSR, MRB, 8D, TECN, or spec update with ECN. Provide guidance to junior Engineers.
  • Setup and troubleshoot issues in recipes/ job files in all metrology tools within the Module.
  • Analyze data from passed down to identify chronic process issues, establish improvement programs and lead engineers to resolve them. Establish CAS / procedures to be followed and work with other departments for resolution if required.
  • Work as a team with both Equipment and Manufacturing Engineers to meet Module objectives. Drive team to meet key indices of Uptime and OEE as per the goals set for these indices.
  • Take on leadership roles to drive a small cross functional task team to address yield improvement/ excursion issues.
  • Facilitate/ initiate CIP programs to optimize process window, cost, yield, and productivity. Establish plans and strategies to optimize process capability to meet operational requirements.
  • Resolve complex technical issues in own Module or yield related issues
  • Follow up with cross-fab benchmarking activities to engage the best-in-campus practices across fabs.
  • Self audit and update specifications / documentation to meet TS16949 Quality Standard requirements.

Requirements:

  • Degree in Electrical / Electronics / Microelectronics / Chemical Process / Chemistry / Physics / Material Sciences / Mechanical
  • Min 2 years of relevant work experience in Thin Film CMP Process.
  • Knowledge in Wafer fabrication process.
  • An excellent team player with good interpersonal, communication and written skills
  • Strong logical thinking capability and good analytical skill
  • High level of integrity with strong leadership attributes to lead and coach a team
  • Highly committed with good ownership and accountability
  • Able to adapt in a fast pace environment and work under pressure
  • Proficient in MS Office Applications
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