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Open nowPosted 16 days ago

Senior/Physical Design Engineer

MyCareersFuture94,028 open roles

Pay
SGD 6,000 – SGD 12,000 a month
Where
West, Singapore
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Your applicationOpen nowSenior/Physical Design EngineerMyCareersFuture · West, Singapore

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This job: posted 16 days ago

The posting

Position Overview

We are seeking a skilled Senior Physical Design Engineer to join our team. As a Senior Physical Design Engineer, you will be responsible for the entire process from RTL to GDS, ensuring the successful implementation of complex semiconductor chips. You will focus on block-level timing closure, formal checks, low power checks, power analysis, and signoff for block-level physical implementation. Your expertise in advanced process nodes, low-power design, and automotive chip physical design will contribute to the development of cutting-edge semiconductor products.

Responsibilities

  • Manage the entire physical design process, including RTL to GDS implementation, for complex semiconductor chips.
  • Achieve block-level timing closure by optimizing design constraints, performing timing analysis, and applying optimization techniques.
  • Conduct formal checks to ensure the design adheres to functional and timing requirements.
  • Perform low power checks and analyze power consumption to optimize power efficiency.
  • Collaborate with the design team to develop and implement UPF (Unified Power Format) for power management and control.
  • Conduct block-level Place and Route (APR), Static Timing Analysis (STA), Power Integrity (PI), Physical Verification (PV), Formal Verification (FM), and Voltage-Current-Latency-Power (VCLP) signoff.
  • Utilize Synopsys and Cadence ARP (Automated Routing and Place) tools to achieve high-quality physical design.
  • Develop and utilize scripts in Tcl, Perl, or Python to automate design tasks and enhance the design flow.
  • Apply your expertise in automotive chip physical design to meet the specific requirements and standards of automotive applications.

Qualification/ Requirements

  • Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related field.
  • Minimum of 3 years of hands-on experience in physical design, working on complex semiconductor chips.
  • Strong experience and understanding of advanced process nodes such as 7nm, 6nm, or 5nm.
  • Proficiency in low power design techniques and hands-on experience with UPF.
  • Experience with block-level APR, STA, PI, PV, FM, and VCLP, using industry-standard tools.
  • Proficient with Synopsys and Cadence ARP tools for physical design.
  • Familiarity with scripting languages such as Tcl, Perl, or Python for automation and design flow improvement.
  • Knowledge and experience in automotive chip physical design, including compliance with automotive standards and requirements.
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