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Open nowPosted yesterday

Senior Process Engineer

MyCareersFuture92,057 open roles

Pay
SGD 10,000 – SGD 17,000 a Monthly
Where
Singapore
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Your applicationOpen nowSenior Process EngineerMyCareersFuture · Singapore

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The clock on this job

Early applications get read.

7.8% of postings close within 7 days. Measured by our own scanner across the market. MyCareersFuture postings stay open a median of 1 days.

Share of postings closed within
  1. 1.7%1 day
  2. 3.5%3 days
  3. 7.8%7 days
  4. 14.6%14 days
  5. 34.1%30 days
This job: posted yesterday

MyCareersFuture median: 1 days open

The posting

Role Summary

Develop, optimize, and qualify thin-film deposition processes supporting advanced packaging and wafer-level integration. The engineer will own film performance, uniformity, stress, adhesion, composition, defectivity, process stability, and integration with the overall packaging process flow.

Key Responsibilities

  • Develop and optimize CVD, PECVD, and related thin-film deposition processes.
  • Develop dielectric, passivation, barrier, liner, and other films used in advanced packaging.
  • Optimize film thickness, uniformity, composition, stress, adhesion, and deposition rate.
  • Establish and maintain robust deposition process windows.
  • Troubleshoot particles, film non-uniformity, adhesion failures, contamination, chamber drift, and process excursions.
  • Design and execute DOEs for process characterization and optimization.
  • Establish SPC and process-control methodologies.
  • Characterize deposited films using appropriate analytical and metrology techniques.
  • Qualify new processes, materials, precursors, and equipment.
  • Work closely with lithography, etch, CMP, plating, bonding, integration, metrology, and manufacturing teams.
  • Support process transfer and manufacturing ramp.

Required Qualifications

  • BS or MS in Materials Science, Chemical Engineering, Chemistry, Electrical Engineering, Applied Physics, or related field.
  • 5+ years of semiconductor thin-film deposition or process-engineering experience.
  • Hands-on experience with CVD, PECVD, PVD, ALD, or related deposition technologies.
  • Strong understanding of thin-film deposition mechanisms and process chemistry.
  • Experience controlling film thickness, uniformity, stress, adhesion, composition, and defectivity.
  • Experience developing and optimizing semiconductor deposition recipes.
  • Strong troubleshooting skills related to chamber performance, particles, film defects, and process excursions.
  • Working knowledge of DOE, SPC, process capability, and root-cause analysis.
  • Experience with semiconductor film characterization and metrology.

Preferred Qualifications

  • Advanced packaging, wafer-level packaging, RDL, TSV, or heterogeneous-integration experience.
  • Experience with SiN, SiO₂, passivation, dielectric, barrier, or seed-layer processes.
  • Hybrid-bonding process experience.
  • Process-integration experience across multiple semiconductor modules.
  • Experience transferring thin-film processes into volume manufacturing.
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