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Open nowPosted 2 days ago

(Senior) Scientist II, Process Modules, APM, IME

MyCareersFuture94,028 open roles

Pay
SGD 5,900 – SGD 11,800 a month
Where
West, Singapore
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Your applicationOpen now(Senior) Scientist II, Process Modules, APM, IMEMyCareersFuture · West, Singapore

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  5. 34.1%30 days
This job: posted 2 days ago

The posting

Research Scientist – Temporary Wafer Bonding & Debonding (R&D) Enable the Future of Advanced Semiconductor Packaging We are seeking a passionate and innovative Research Scientist to join our multidisciplinary R&D team to develop temporary wafer bonding and debonding (TBDB) technologies for next-generation semiconductor packaging. This is an exciting opportunity to work on enabling technologies for 3D ICs, chiplets, heterogeneous integration, and wafer-level packaging, transforming research ideas into robust manufacturing solutions.

Key Responsibilities • Develop and optimize temporary wafer bonding and debonding processes for advanced semiconductor packaging. • Design and execute DOE to improve process capability, yield, and reliability. • Develop solutions for thin-wafer handling, layer transfer, debonding, cleaning, and warpage control. • Investigate process challenges through systematic root-cause analysis and implement corrective actions. • Collaborate with design, integration, equipment, and reliability teams to develop robust process solutions. • Collaborate with vendor to evaluate and qualify new bonding materials, carrier systems, and equipment. • Perform wafer characterization using advanced metrology and failure analysis techniques. • Analyse process data, establish process control methods, and document technical results. • Contribute to technology innovation through patents, publications, and collaboration with internal and external partners.

Qualifications • Ph.D. in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, chemistry, or a related discipline. At least 5 years of experience. • Hands-on experience in semiconductor process development within a cleanroom environment. • Experience in temporary bonding, wafer bonding, advanced packaging, thin-wafer processing, semiconductor assembly, or related process modules is preferred. Fresh Ph.D. graduates with strong research interest are welcome to apply. • Strong analytical and problem-solving skills with experience in DOE and statistical data analysis. • Self-motivated team player with excellent communication and teamwork skills with a passion for developing innovative semiconductor technologies.

The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.

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