The posting
Job Description:
· Lead the Thin Film Process section tomaintain high team morale and deliver strong KPIs and sustainable long-termperformance.
· Ensure compliance with MRB, TECN, 8D,specifications, and QMS tools (SPC, FMEA) to enable timely issue detection andeffective resolution.
· Drive risk management and continuousimprovement initiatives to prevent quality, yield, and excursion issues.
· Define targets and lead improvement projectsto reduce wafer scrap, defects, and rework, while improving process capability.
· Track and ensure project execution alignswith fab performance and operational requirements.
· Forecast budgets while driving costoptimization initiatives.
· Collaborate with Process and Manufacturingteams to resolve process constraints, improve OEE, and optimize metrologysampling.
· Manage vendor performance to enhance quality,cost efficiency, and service support.
· Ensure full compliance with EHS standards andmaintain high housekeeping practices.
· Set clear performance expectations, conductregular reviews, and support team capability development and careerprogression.
· Ensure effective training, competencydevelopment, and proper documentation of technical knowledge.
Requirements:
· Degree in Electrical / Electronics /Microelectronics / Chemical process/ Chemistry/Physics/ MaterialSciences/Mechanical
· 8 years of relevant work experience in ThinFilm CMP Process.
· Strong and proven experience in Waferfabrication process in thin film section.
· Min 5 years of proven trackrecord in a managerial role with strong leadership capabilities.
· An excellent team player with goodinterpersonal, communication and written skills
· High level of integrity with strongleadership attributes to lead and coach a team
· Highly committed with good ownership andaccountability
· Able to adapt in a fast-paced environment andwork under pressure
· Proficient in MS Office Applications and gooddata analytical skill.



