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Open nowPosted 15 days ago

Staff / Senior Staff Engineer Package Technology Development

MyCareersFuture94,028 open roles

Pay
SGD 6,000 – SGD 10,000 a month
Where
West, Singapore
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Your applicationOpen nowStaff / Senior Staff Engineer Package Technology DevelopmentMyCareersFuture · West, Singapore

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This job: posted 15 days ago

The posting

My client is a big Semiconductor in Singapore.

Key responsibilities in your new role

  • Responsible for outsourced package platform qualification (lead and follower products) and process optimization at subcons to meet the time-to-market, product quality level, process capability and assembly yield target.
  • Responsible for package definition tasks in OSAT segment in defining project complexity definition with Delta assessment list, project category assessment and Perform project risk assessment with mitigation actions.
  • Responsible for integration of unit processes till process freeze for assembly and test at subcons which entails creating assembly specification, marking instruction and packing specification for upload into Database.
  • Apply and verify design rules based on established baseline documents as well as specific equipment and process capability of specific assembly sites. This includes OSATs technical capability assessment support role.
  • Define process and select Bill of Material as needed to meet MSL, reliability level, and other specific package requirements for development and pre-development.
  • Responsible for enabling of new package platform and derivatives packages, and support of technology and package development at OSAT. This includes new subcon enabling support role.
  • As a driver or co-driver for platform related Task force activities and has ability to drive for technical problem solving.

Qualifications and skills to help you succeed

  • Master or Bachelor degree in Engineering disciplines.
  • Minimum 10 years’ working experience of package development in new product introduction or process (pre-assembly, assembly and test) and 3 years in supporting project management.
  • Experience in Module assembly, Wafer level package (WLP), bumping, eWLB and System in Package (SiP) will be a key advantage.
  • Good knowledge of processes and material in both laminates and leadframe packages and interaction to the different functions (laminate/ leadframe design, design rules, process)
  • Good understanding of quality requirements / release criteria (e.g. JEDEC/AEC grade) that fits and matches product/package design and BOM sets selection.
  • Strong analytical skills, ability to deal with conflict. Live up to high quality standards. Good quality mind-set and excellent problem solving.
  • Demonstrates active knowledge transfer and best practice sharing across organizational boundaries, be ambitious and ability to make timely decisions.
  • Highly motivated with the ability to prioritize, perform under pressure and get team members and stakeholders involved and to motivate them.
  • Ability to collaborate and work as a team with various stakeholders and partners in multi-site/multi-cultural teams.
  • Strong in communication and people interpersonal skills across all levels.
  • Experience in Subcon management.

Kris Lam (R1983356)

Director

Recruitmatic Pte. Ltd. (22S1186)

2 Venture Drive #14-02

Vision Exchange S608526

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