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Open nowPosted 17 days ago

TCB Product Manager

MyCareersFuture94,028 open roles

Pay
SGD 10,000 – SGD 20,000 a Monthly
Where
Central, Singapore
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Your applicationOpen nowTCB Product ManagerMyCareersFuture · Central, Singapore

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This job: posted 17 days ago

The posting

TCB Product Manager

Job Summary:

We are seeking an experienced TCB (Thermal CompressionBonding) professional to lead the development of new TCB products whilemanaging a team of TCB Engineers and TCB Process Engineers. This role is bothhands-on and leadership-oriented: you will drive product and processdevelopment from concept to mass production, and you will build, mentor, andmanage a high-performing engineering team.

Key Responsibilities:

A. New TCB Product & Process Development

  • Lead the development of new TCB products, including process evaluation, process flow formulation, and module functional verification to ensure Design for Manufacturability (DFM).
  • Drive the development and debugging of TCB process parameters (temperature, pressure, time, heating/cooling rates, etc.) and resolve critical process bottlenecks such as warpage control, coplanarity, and void rate.
  • Evaluate and qualify new TCB materials, equipment, and consumables in collaboration with R&D, Quality, and Production teams.
  • Lead NPI (New Product Introduction) projects, ensuring smooth transition from pilot run to mass production.
  • Promote CIP (Continuous Improvement Plan) for major equipment and product abnormalities; lead Failure Analysis (FA) and issue improvement reports.
  • Monitor process stability (Cpk/Ppk) and product yield; use data-driven methods to adjust processes and drive yield improvement.
  • Develop and refine technical documentation, including PFD, SOP, OCAP, EFMEA, and inspection standards.

B. Team Management & Leadership

  • Manage, mentor, and develop a team of TCB Engineers and TCB Process Engineers.
  • Assign tasks, set priorities, and ensure project milestones are met on time and within budget.
  • Conduct regular performance reviews, provide technical guidance, and support career development for team members.
  • Foster a culture of collaboration, accountability, and continuous improvement.
  • Coordinate team resources across multiple projects and ensure effective knowledge transfer and documentation.
  • Interface with cross-functional teams (R&D, Quality, Production, Equipment) to align engineering resources with business objectives.

Qualifications:

Education:

  • Bachelor’s degree or above in Electronics, Mechanical Engineering, Automation, Materials Science, Physics, Chemistry, or related fields.
  • Master’s degree or above preferred.

Work Experience:

  • Minimum of 5–8 years of experience in TCB-related equipment and process development in semiconductor packaging, with at least 2 years in a team lead or supervisory role.
  • Prior experience in 2.5D/3D advanced packaging and HBM stacking is highly preferred.
  • Familiar with Thermal Compression Bonding (TCB) or Hybrid Bonding (HB) processes.

Professional Skills:

  • Proficient in operation, process debugging, and troubleshooting of mainstream TCB/FC equipment (e.g., ASM Firebird/Adept, Shibaura, K&S Aptura, Datacon, Hanmi, etc.).
  • Deep understanding of thermal compression bonding mechanisms; experience with Fluxless bonding, Formic Acid reduction process, or Underfill process is highly preferred.
  • Strong data analysis skills; proficient in JMP, Minitab, DOE, and yield analysis.
  • Strong quality awareness and hands-on capabilities; able to work under pressure and handle overtime when necessary.
  • Excellent communication, coordination, and teamwork skills.
  • Proven ability to lead, motivate, and develop technical teams.

Preferred / Nice-to-Have:

  • Experience with advanced packaging technologies such as CoWoS, SoIC, or chiplet integration.
  • Familiarity with customer-facing technical reviews and product qualification cycles.
  • Experience in setting up new TCB process lines or transferring processes from R&D to production.

Working Conditions:

  • May require occasional overtime and travel to support production or customer requirements.
  • Work primarily in engineering labs, cleanroom, and office environments.
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