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Open nowPosted 3 days ago

Technology Development Product Engineer

MyCareersFuture94,028 open roles

Pay
SGD 4,500 – SGD 6,000 a month
Where
West, Singapore
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Your applicationOpen nowTechnology Development Product EngineerMyCareersFuture · West, Singapore
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This job: posted 3 days ago

The posting

Responsibilities

The Product Engineer (PE) / First Article Inspection Engineer (FAI) serves as a key technical interface between Design Engineering, Manufacturing, Process Engineering, Quality, and customer requirements. The role is responsible for driving product bring-up, New Product Introduction (NPI), FAI, manufacturing readiness, yield improvement, failure analysis, and continuous improvement throughout the product lifecycle—from initial product introduction through mass production and end-of-life.

The ideal candidate has strong experience in product engineering and semiconductor/electronics manufacturing, with hands-on knowledge of PCB/substrate fabrication, electrical and mechanical performance, manufacturing processes, statistical data analysis, yield improvement, and failure analysis.

1. Product Ownership & Manufacturing Excellence

  • Lead end-to-end ownership of assigned products throughout the product lifecycle, from design, NPI, and FAI through mass production and end-of-life.
  • Drive and monitor product performance, manufacturing yield, reliability, quality, and field performance to meet operational and customer requirements.
  • Ensure products meet defined electrical, mechanical, quality, reliability, and manufacturing requirements throughout the product lifecycle.

2. Yield Engineering & Continuous Improvement

  • Analyze manufacturing and post-manufacturing test data using statistical analysis and data-mining techniques to identify trends/risk, root causes, and improvement opportunities.
  • Drive corrective and preventive actions to improve yield, quality, cost, and manufacturing efficiency.
  • Identify opportunities for continuous improvement.
  • Establish appropriate sampling and data collection strategies from volume production units to monitor and optimize product and process performance.

3. Manufacturing Readiness & Production Support

  • Support production ramp-up and soft launch activities, monitoring product and process performance against defined targets.
  • Support customer and internal technical reviews related to product performance, manufacturing readiness, quality, and reliability.

4. Product Engineering & Process Development

  • Evaluate PCB and substrate manufacturing processes and their impact on product electrical, mechanical, and reliability performance.
  • Apply knowledge of key PCB/substrate manufacturing processes, including:
  • Build-up insulation
  • Dry Film Resist (DFR) patterning
  • Plating
  • Solder resist
  • Automated Optical Inspection (AOI)
  • Automated Optical Shaping (AOS)

Perform any other ad-hoc duties as assigned by the Manager, as required to support the team and organizational goals.

Qualifications & Requirements

  • Bachelor’s degree or higher in Electrical and Electronics Engineering, Electrical Engineering, Mechanical Engineering, or a related engineering discipline.
  • Minimum 4–5 years of relevant experience in product engineering, semiconductor manufacturing, electronics manufacturing, or related industries.
  • Strong background in product engineering, semiconductor packaging, PCB/substrate manufacturing, and process development.
  • Hands-on experience with manufacturing processes and product characterization, yield analysis, troubleshooting, and failure analysis.
  • Experience leading or supporting NPI projects from product verification and qualification through production ramp and high-volume manufacturing is highly desirable.
  • Strong understanding of mechanical engineering principles and their application to semiconductor packaging and product performance.
  • Self-motivated, proactive, and able to work independently with minimal supervision.
  • Strong interpersonal, communication, and cross-functional collaboration skills.
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