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Open nowPosted 29 days ago

(UP$10K) Packaging Application Engineer (Thermo Compression Bonding) {hkhdv}

MyCareersFuture94,028 open roles

Pay
SGD 8,000 – SGD 10,000 a month
Where
Singapore
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Your applicationOpen now(UP$10K) Packaging Application Engineer (Thermo Compression Bonding) {hkhdv}MyCareersFuture · Singapore

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This job: posted 29 days ago

The posting

Position title : Senior Advanced Packaging Application Engineer (Thermo Compression Bonding – TCB)

Location: Woodlands/Sembawang Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : SGD 8,000 – SGD 10,000/month (Based on experience and technical capability).

Responsibilities:

Customer Application Engineering

  • Understand customer packaging roadmaps and manufacturing requirements.
  • Translate process requirements into equipment specifications.
  • Participate in customer technical discussions and application reviews.
  • Support technical sales activities and customer demonstrations.
  • Gather customer feedback and recommend future product enhancements.

Advanced Packaging Process Development

-Develop and support applications involving:

  • Thermo Compression Bonding (TCB)
  • Flip Chip Assembly
  • Hybrid Bonding
  • HBM Packaging
  • CoWoS
  • CoPoS
  • 2.5D Packaging
  • 3D Packaging
  • Chiplet Integration
  • Large Die Packaging

-Evaluate and optimize:

  • Bond force
  • Temperature profiles
  • Process windows
  • Alignment accuracy
  • Package warpage
  • Yield
  • Reliability

Equipment Development

-Work closely with multidisciplinary engineering teams to define:

  • Machine architecture
  • Functional specifications
  • Accuracy requirements
  • Throughput targets
  • Thermal performance
  • Bonding process capability
  • Reliability requirements
  • Customer acceptance criteria

Provide technical guidance throughout equipment development.

Machine Qualification

Serve as the internal customer during equipment development.

Responsibilities include:

  • Defining machine acceptance criteria
  • Process qualification
  • FAT and SAT support
  • Customer buyoff support
  • Qualification reporting
  • Continuous performance improvement

Technology & Market Intelligence

Monitor industry developments in:

  • Advanced packaging technologies
  • Semiconductor manufacturing trends
  • Customer requirements
  • Competitor equipment
  • Emerging packaging architectures

Support future product strategy and technology roadmap planning.

Requirements:

- Bachelor's or Master's Degree in:

  • Materials Engineering
  • Mechanical Engineering
  • Electrical Engineering
  • Chemical Engineering
  • Physics
  • Semiconductor Engineering
  • Related Engineering disciplines

-Minimum 5 years experience in semiconductor advanced packaging.

-Hands-on experience in one or more of the following:

  • Thermo Compression Bonding (TCB)
  • Advanced Packaging Process Development
  • Flip Chip Assembly
  • New Product Introduction (NPI)
  • Process Qualification
  • Equipment Qualification
  • Manufacturing Engineering
  • Customer Process Development

- Experience supporting advanced package technologies such as:

  • HBM
  • CoWoS
  • CoPoS
  • Chiplets
  • 2.5D Packaging
  • 3D Packaging
  • Large Die Packaging

- Experience with TCB equipment from ASMPT, BESI, Toray, Panasonic, Kulicke & Soffa or similar suppliers will be an advantage.

- Candidates currently or previously employed by semiconductor manufacturers or advanced packaging companies are strongly encouraged to apply.

- Strong understanding of:

  • Thermo Compression Bonding (TCB)
  • Semiconductor Packaging
  • Flip Chip Assembly
  • Process Qualification
  • SPC
  • DOE
  • Yield Improvement
  • Reliability Testing
  • Failure Analysis
  • Package Warpage
  • Thermal Management
  • Alignment Accuracy
  • Semiconductor Manufacturing Processes

- Knowledge of AI accelerator packaging, HBM integration or heterogeneous integration will be highly regarded.

Interested applicants can also send your resume to WA:+65 88141540 (Dominic) and allow our Consultant to match you with our Clients. There are more related or other job to match as well.

No Charges will be incurred by Candidates for any service rendered.

Ho Kay Heng Dominic Reg No: R26162365 | The Supreme HR Advisory Pte Ltd EA No: 14C7279

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