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Open nowPosted today

<New Graduate Hiring> Wire Bond Process Engineer

nxp810 open roles

Where
Kaohsiung
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Your applicationOpen now<New Graduate Hiring> Wire Bond Process Engineernxp · Kaohsiung

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The clock on this job

Early applications get read.

13.7% of postings close within 7 days. Measured by our own scanner across the market. nxp postings stay open a median of 17 days.

Share of postings closed within
  1. 2.3%1 day
  2. 4.8%3 days
  3. 13.7%7 days
  4. 22.1%14 days
  5. 37.2%30 days
  6. 59.1%60 days
This job: posted today

nxp median: 17 days open

The posting

  • Monitor and optimize Wire Bond manufacturing processes to achieve targets in Quality, Yield, Productivity, and Cost.
  • Investigate manufacturing issues, customer complaints, and quality excursions by performing root cause analysis and implementing corrective/preventive actions.
  • Drive continuous improvement projects to enhance process robustness, equipment utilization, OEE, yield performance, and operational efficiency.
  • Establish and maintain process control systems, including SPC, OCAP, FMEA, control plans, and engineering specifications.
  • Collaborate with cross-functional teams including Production, Equipment Engineering, Quality, Industrial Engineering, Planning, and R&D to resolve manufacturing challenges and improve factory performance.
  • Analyze manufacturing data and develop data-driven solutions for process optimization and defect reduction.
  • Conduct regular Gemba activities, risk assessments, and process audits to ensure manufacturing compliance and operational excellence.
  • Support customer audits, internal audits, and quality management system requirements.
  • Drive factory KPIs improvement, including Yield, Quality, Capacity, OEE, Cycle Time, and Cost Reduction targets.

Requirements:

  • Bachelor’s degree or above in Engineering or a related field.
  • TOEIC 600+ or equivalent English proficiency.
  • Within 2 years of working experience. Semiconductor industry experience is preferred.
  • Good communication and teamwork skills.
  • Leadership experience or potential is a plus.
  • Proactive, responsible, and willing to learn in a dynamic environment.

More information about NXP in Greater China...

#LI-2370

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