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Open nowFirst seen 3 days ago

Head of Consumer Electronics Packaging Engineering (Requires Relocation)

Shanghai BSF354 open roles

Where
Taipei, Taiwan
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Your applicationOpen nowHead of Consumer Electronics Packaging Engineering (Requires Relocation)Shanghai BSF · Taipei, Taiwan

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The clock on this job

Early applications get read.

12.1% of postings close within 7 days. Measured by our own scanner across the market.

Share of postings closed within
  1. 2.1%1 day
  2. 4.5%3 days
  3. 12.1%7 days
  4. 19.1%14 days
  5. 35.6%30 days
  6. 52.7%60 days
This job: first seen 3 days ago

The posting

Job brief

We are seeking a highly qualified Package Process Engineering leader to join our dynamic team within the consumer electronics industry. The ideal candidate will possess a robust background in package development and engineering, coupled with specialized knowledge of Apples packaging products and processes.

Responsibilities

  • Research and Analysis: Conduct research on technology trends in the industry and competitors to formulate strategic development plans.
  • Technical Management: Develop and modify the company's technical management system and process standards, including safety regulations.
  • New Technology Implementation: Oversee the introduction of new technologies and product development to expand product variety.
  • Project Participation: Engage in equipment selection, trial production, and process design for new product projects.
  • Problem Solving: Address and coordinate solutions for technical issues during production and sales.
  • Strategic Planning: Lead the planning and implementation of initiatives related to new materials, processes, and automation, setting improvement goals.
  • Technical Seminars: Organize and participate in seminars to define development directions and technical frameworks.
  • Project Leadership: Effectively lead project teams and manage priority initiatives to improve processes and outcomes.
  • Personnel Management: Train and assess department personnel, ensuring they fulfill their responsibilities.

Requirements

  • Experience: At least 10 years of package development or engineering experience, ideally in a key role within the consumer electronics sector.
  • Familiarity with Apple Products: Applicants should be well-versed in the manufacturing processes, automated machinery, and materials used in Apples packaging solutions.
  • Educational Background: A bachelors degree in Engineering or package related field is required.
  • Relocation: The position requires the candidate to be open to relocating to Mainland China for a long-term commitment.
  • Communication Skills: Experience in directly communicating with key personnel involved in Apples packaging products or engineering processes is preferred.
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