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Open nowFirst seen 2 days ago

8XXRXR9 | Sales Engineer (Wire Bonding / Semiconductor Packaging Malaysi

TTUKoffer137 open roles

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Your applicationOpen now8XXRXR9 | Sales Engineer (Wire Bonding / Semiconductor Packaging MalaysiTTUKoffer

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  5. 35.6%30 days
  6. 58.1%60 days
This job: first seen 2 days ago

The posting

Sales Engineer (Wire Bonding / Semiconductor Packaging Malaysia)

Location: Malaysia (covering Malaysia & SEA)

Reporting to: Regional PM

Type: Full-time

Company Background

The company specializes in ceramic bonding tools and advanced ceramic products used in semiconductor packaging and have manufacturing and R&D bases in Shenzhen and Hefei.

Role Overview

This role focuses on promoting and supporting ceramic bonding wedges used in wire bonding applications, especially for Semiconductor Assembly & Packaging customers in Malaysia and Southeast Asia.

The position combines technical understanding + customer interaction + commercial execution.

Key Responsibilities

1. Sales & Market Development

  • Promote bonding wedge products to semiconductor customers in Malaysia and nearby markets
  • Identify new business opportunities and expand customer base
  • Maintain long-term customer relationships
  • Regularly visit customers, understand bonding process requirements and challenges
  • Collect market and competitor information

2. Technical Support

  • Provide bonding-tool introductions and product presentations
  • Participate in technical discussions and bonding evaluations
  • Understand customer bonding parameters, materials and process flow
  • Support customers in product selection, evaluation and adoption
  • Coordinate technical support with HQ engineering team
  • Provide pre-sales and after-sales application support

Qualifications

  • Diploma/Bachelor degree or above (engineering background preferred)
  • Experience in semiconductor packaging or bonding (Wire Bond, Die Bond, etc.)
  • Knowledge of bonding tools or bonding process strongly preferred
  • Strong communication ability and willingness to interact with customers
  • Able to understand technical requirements and translate to product solutions

Preferred Experience

  • Wire Bond process (Thermosonic bonding / wedge bonding)
  • FOA / assembly & test environment
  • Process optimization, DOE, yield improvement
  • Customer support exposure

Soft Skills

  • Technical curiosity and willingness to learn new products
  • Strong communication and problem-solving ability
  • Comfortable interacting with customers and suppliers
  • Self-driven and able to independently manage activities

Travel

  • Mainly domestic Malaysia customer visits
  • Occasional Southeast Asia travel

Why This Role

  • Growing application in semiconductor packaging
  • Advanced ceramic bonding tools with high technical depth
  • Opportunity to work closely with customers and industry leaders
  • Suitable for engineers who want to move toward technical sales / application support

Interview Process

  • 2 rounds
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