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Open nowPosted 70 days ago

芯片设计类（研发）

zj-innolight/30030875 open roles

Where
Suzhou, Jiangsu, Chinese Mainland
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Your applicationOpen now芯片设计类（研发）zj-innolight/300308 · Suzhou, Jiangsu, Chinese Mainland

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The clock on this job

Early applications get read.

12.3% of postings close within 7 days. Measured by our own scanner across the market.

Share of postings closed within
  1. 2.1%1 day
  2. 4.5%3 days
  3. 12.3%7 days
  4. 19.3%14 days
  5. 35.6%30 days
  6. 58.1%60 days
This job: posted 70 days ago

The posting

1. 光芯片与器件设计与仿真（在导师/技术骨干指导下） - 参与III-V族（InP）及硅基（SiPh）光芯片的研究与开发，协助完成器件建模、多物理场仿真、结构设计与优化工作核心器件方向包括：高速电光调制器（MZM）、高速光电探测器（PD）、光无源器件（耦合器、波分复用器）及MEMS光芯片（微镜、光开关）等 - 使用专业软件进行光学、电学、热学及力学多维度仿真，协助输出器件可行性分析、设计文档及技术报告 2. 版图实现与流片对接（在指导下完成） - 参与光电收发芯片的物理版图（Layout）设计，使用KLayout、L-Edit或Virtuoso等工具完成从原理图到GDSII文件的生成 - 在导师指导下与流片厂商（Foundry）进行技术沟通，学习并遵循PDK（工艺设计套件）规则，熟悉流片全流程 3. 测试平台搭建与模型校准（在指导下参与） - 参与光芯片与器件测试平台的搭建与调试，协助开展性能测试（包括插损、带宽、眼图、光谱响应等关键指标） - 参与测试数据的处理与分析，辅助提取器件参数，支持“设计-仿真-测试”闭环的建立与优化 4. 系统协同与项目支持 - 与跨部门团队（如电芯片设计、封装、系统集成团队）协作，支持光电共封装（CPO）等前沿项目，在团队中承担具体研发任务 - 参与光通信系统级需求分析，理解芯片设计指标与系统应用之间的对应关系

1. 2027届硕士及以上学历，光电类、光学工程类、电子工程类、微电子类、物理学类等相关专业 2. 211-双一流院校及以上优先 3. 在校期间有光芯片/光器件相关课题研究方向，具备扎实的理论基础 4. 专业技能 - 器件物理基础：深刻理解光通信系统中各类光器件的工作原理（如载流子色散效应、量子限制斯塔克效应、MEMS静电力驱动、波导光学等），能将物理原理与器件设计建立联系 - 仿真工具：熟练使用以下至少两类设计仿真工具（可在项目/课题中证明）： - 光学/光电子：Lumerical（FDTD/MODE/INTERCONNECT）、RSoft、Photon Design、Silvaco TCAD - 电磁/多物理场：Ansys HFSS、COMSOL Multiphysics - 电路/版图：Cadence Virtuoso、Mentor Graphics（L-Edit）、KLayout、ADS - 测试与调试（加分项） ：了解光通信器件测试流程，有网络分析仪、光谱仪、误码仪等测试仪器操作经验者优先 - 编程能力：熟练使用Python、MATLAB或类似工具，有数据处理、仿真自动化或科学计算经验 - 流片经验（加分项） ：具备硅光（SiPh）或III-V族（InP）芯片流片/MPW项目经历，或在校课题中有流片相关合作经验 5. 软技能 - 逻辑与学习能力：逻辑清晰，善于分析和解决技术问题，具备快速学习新工具、新工艺的能力 - 沟通与协作：具备良好的团队合作精神和跨部门沟通意识，乐于分享与交流技术见解 - 工程素养：具备规范的文档编写习惯，责任心强，能在多任务环境中高效交付 6. 英语CET-6及以上，能够熟练阅读英文技术文献及Foundry PDK文档，具备英文技术报告撰写能力

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