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Open nowPosted 99 days ago

Dielectric and Polymer Materials Engineer

Absolics Inc17 open roles

Pay
$90,000 – $150,000 a year
Where
Covington, Georgia
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Your applicationOpen nowDielectric and Polymer Materials EngineerAbsolics Inc · Covington, Georgia

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The clock on this job

Early applications get read.

8.2% of postings close within 7 days. Measured by our own scanner across the market. Absolics Inc postings stay open a median of 19 days.

Share of postings closed within
  1. 1.8%1 day
  2. 3.6%3 days
  3. 8.2%7 days
  4. 15.2%14 days
  5. 34.0%30 days
This job: posted 99 days ago

Absolics Inc median: 19 days open

The posting

Job Title: R&D Engineer - Dielectric and Polymer Materials Expert for Advanced Packaging applications

Location: Covington, GA

Job Type: Full-Time

About Us: Absolics is a leading provider of advanced packaging technologies and services, offering scalable solutions for businesses of high-performance computing. We offer smart, innovative services to dozens of clients globally. By dedicating our efforts to establishing large glass substrates with built-in active and passive elements, our goal is to provide significant improvement in signaling characteristics and power consumption compared to existing solutions.

Job Description:

You will lead efforts to evaluate, down select and integrate the various Advanced Packaging Organic and Polymeric materials critical to advanced packaging process flows, with responsibility spanning material selection, film deposition or lamination, patterning, and cure characterization. In addition, you will oversee evaluation of material performance with respect to reliability testing and collaborate with downstream assembly teams to understand incoming assembly. Requirements. This role requires both materials science depth and process integration awareness. You will evaluate both emerging and established dielectric systems and drive their optimization across electrical, mechanical, and reliability dimensions.

Key Responsibilities:

  • Characterize dielectric film properties (electrical, thermal, mechanical) and correlate to process and reliability outcomes
  • Select, qualify, and support process window definition of advanced packaging dielectrics (example ABF, PBO, PSPI, polyimide, inorganic films) for RDL build-up
  • Support determination of optimal processing conditions for these materials across the various process teams critical to the overall fabrication process flow
  • Evaluate emerging dielectric materials and technologies (e.g., low-Dk/Df, glass core compatible systems) for roadmap fit
  • Develop and optimize cure, lamination, or photopatterning sequences for novel dielectric layers being tested
  • Investigate and resolve adhesion, delamination, cracking, or CTE-mismatch failures through materials and process analysis
  • Run reliability qualification testing (HAST, TCT) and interpret dielectric-driven failure mechanisms

Required Skills:

  • Hands-on experience evaluating, processing and/or successful qualification of two or more advanced packaging dielectrics, example ABF, PBO, PSPI, PID, Solder resist or BCB
  • Deep knowledge of dielectric patterning approaches: photoexposure, develop, and cure sequences for photosensitive materials; or lamination and laser drill for non-photosensitive films
  • Extensive experience with film characterization: ellipsometry, FTIR, TGA/DSC, profilometry, nanoindentation
  • Understanding of dielectric-to-metal adhesion, CTE mismatch, and stress management in multilayer stacks
  • Experience with electrical characterization of dielectric films (Dk, Df, leakage, breakdown voltage)
  • Ability to execute reliability testing per JEDEC standards (HAST, uHAST, TCT) and interpret failure mechanisms
  • Fluent in English; proficiency in Korean is a plus.

Preferred Skills

  • Direct experience with glass core or glass interposer dielectric process integration
  • Deep Familiarity with low-Dk/low-Df materials targeting high-frequency and AI/HPC applications
  • Knowledge of plasma-enhanced CVD or PVD inorganic dielectrics for thin-film packaging
  • Experience with CMP of dielectric films in damascene or hybrid bonding contexts
  • Background in failure analysis of dielectric delamination, cracking, or via integrity (FIB-SEM, TEM, laminography)
  • Familiarity with JEDEC and IPC qualification standards for substrate dielectrics
  • Track record of material supplier engagement and collaborative efforts for material testing and qualification
  • Publication record or patent activity in dielectric materials for packaging is a plus

Education

  • Ph.D. in Materials Science, Polymer Science, Chemical Engineering, Electrical Engineering, or related field preferred
  • M.S. with 3+ years of relevant industry or research experience considered

Benefits:

  • 401K 6% matching (NO vesting period)
  • Healthcare 100% support (Health, Dental, Vision)
  • Life, STD, LTD 100 % support
  • Cell phone allowance
  • PTO and self-development

SALARY:

  • $90,000 – $150,000
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