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Open nowFirst seen 37 hours ago

Senior Test Engineer

ADI Group851 open roles

Where
Ipoh, Perak, Malaysia
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Your applicationOpen nowSenior Test EngineerADI Group · Ipoh, Perak, Malaysia
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The clock on this job

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11.9% of postings close within 7 days. Measured by our own scanner across the market.

Share of postings closed within
  1. 2.1%1 day
  2. 4.4%3 days
  3. 11.9%7 days
  4. 18.6%14 days
  5. 35.6%30 days
  6. 45.1%60 days
This job: first seen 37 hours ago

The posting

JOB RESPONSIBILITIES:

  • Establish the test capability and the capacity/productivity model.
  • Able to fully define and characterize the designated process
  • Define the PCP and improving critical test capability (as defined in the process control plan, product drawings/ specification and BOM)
  • Fully understand the necessary controls, equipment, precautions, setup parameters to meet the product and test specifications.
  • Apply lean manufacturing principles to eliminate waste in the production process and implement yield improvement projects.
  • Responsible for the test yields of the designated process. Responsible to establish and implement all appropriate actions to improve the yields.
  • Responsible to conduct gage repeatability & reliability studies, correlation studies as well as actions to improve both these capabilities. Generate reaction plans for OOC situations
  • Assist the manufacturing personnel in operator training, qualification and improving operator utilization and productivity as well as inventory reduction
  • Communication skill to communicate and interface well with peers, enhance teamwork
  • Emotional intelligence
  • Derive Continual Improvement and use of resources
  • Performing any other duties as directed by the immediate superior from time to time.
  • Practice Risk Base Thinking in planning and execution of task.
  • Compliance to ISO Requirements, company rules & regulations, applicable codes etc.

JOB REQUIREMENTS

  • Minimum: Masters/bachelors degree in electrical/Electronics/Materials/Mechanical Engineering.
  • Minimum 5years of working experience in wire bond process, preferably in the area of high speed devices >1GHz.
  • Experience in MNC manufacturing environment, preferably in metal can/TO can manufacturing line.
  • Solid DOE and SPC experience.
  • Good knowledge of FOL/semiconductor processes.
  • Very good communication skills and ability to work effectively in a cross functional environment with people at all levels.
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