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Open nowPosted 23 days ago

Staff Process Engineer (Die Attach)

nexperia256 open roles

Where
Seremban
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Your applicationOpen nowStaff Process Engineer (Die Attach)nexperia · Seremban

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The clock on this job

Early applications get read.

13.1% of postings close within 7 days. Measured by our own scanner across the market. nexperia postings stay open a median of 10 days.

Share of postings closed within
  1. 2.2%1 day
  2. 4.7%3 days
  3. 13.1%7 days
  4. 21.1%14 days
  5. 35.7%30 days
  6. 58.7%60 days
This job: posted 23 days ago

nexperia median: 10 days open

The posting

Position Overview

As a Die Bond Process Staff Engineer, you will be responsible for leading and managing all Die Attach/Die Bond manufacturing processes to achieve world-class quality, yield, productivity, and reliability performance. The role is accountable for process development, optimization, qualification, and sustaining activities while ensuring robust process control, continuous improvement, and successful new product introduction (NPI). You will lead a team of Process Engineers and work closely with Production, Equipment Engineering, Quality, R&D, Customers, and Suppliers to drive operational excellence and meet business objectives.

Key Responsibilities (Die Bond Specific)

  • Own and manage all Die Bond process technologies, including epoxy die attach, Eutectic die bond process, and advanced die attach processes as applicable.
  • Drive Die Bond process optimization improves yield, eliminates defects, and enhances equipment utilization.
  • Establish and maintain critical process controls for die placement accuracy, bond line thickness, epoxy coverage, void performance, die shear strength, and overall package reliability.
  • Lead root cause analysis and corrective actions for Die Bond-related quality excursions using 8D, DMAIC, Fishbone, DOE, and statistical methodologies.
  • Develop and execute process qualification plans for new materials, equipment, packages, and technology transfers.
  • Partner with Equipment Engineering to improve machine capability, preventive maintenance strategies, uptime, OEE, and MTBA performance.
  • Lead NPI and package transfer activities involving Die Bond process development, validation, and volume ramp-up.
  • Monitor and improve key Die Bond KPIs including:
  • Die Placement Accuracy
  • Epoxy Coverage Performance
  • Voids Performance Die Shear Strength Yield Loss OEE MTBA Customer Complaint Rate
  • Drive process characterization activities using DOE and statistical analysis to define process windows and improve robustness.
  • Ensure compliance with IATF16949, customer requirements, Control Plans, PFMEA, SPC, and other quality management system requirements.
  • Lead customer audits, qualification reviews, failure analysis discussions, and technical presentations related to Die Bond processes.
  • Build technical competency of engineers, technicians, and operators through training, coaching, and mentoring.

Skills / Competencies

Hard Competencies

  • Expert knowledge of Die Bond process and equipment.
  • Strong understanding of semiconductor packaging technologies.
  • Advanced DOE, SPC, MSA, PFMEA, Control Plan, and Statistical Analysis.
  • Failure Analysis and Root Cause Investigation.
  • Process Characterization and Validation (IQ/OQ/PQ).
  • Knowledge of epoxy materials, solder attach, sintering, and packaging reliability.
  • Strong data analytics capability using JMP, Minitab, Excel, or equivalent tools.

Soft Competencies

  • Strategic leadership and talent development.
  • Effective stakeholder management.
  • Strong communication and influencing skills.
  • Results-oriented and customer-focused mindset.
  • Cross-functional collaboration and project leadership.

Job Specifications

  • Bachelor's Degree or master’s degree in engineering (Electrical, Electronic, Mechanical, Material Science, Physics, or equivalent).
  • Minimum of 10 years of semiconductor assembly experience with at least 5 years in Die Bond process engineering leadership.
  • Proven experience managing engineers and technical teams.
  • Strong expertise in Die Bond equipment, materials, and process optimization.
  • Experience in NPI, package transfer, and high-volume manufacturing environments.
  • Familiar with Automotive Quality Standards (IATF16949, VDA, APQP, PPAP, FMEA).
  • Experience supporting customer audits and problem-solving activities.
  • Knowledge of Wire Bond interaction effects and package reliability is an advantage.

KPIs (Die Bond Focus)

  • Die Bond Yield
  • Die Placement Accuracy Performance
  • Epoxy Defect PPM
  • Void Rate
  • Die Shear Performance
  • OEE / Uptime
  • MTBA
  • Customer Complaint Rate
  • Hold Lot Rate
  • Action Closure Rate
  • Process Capability (Cp/Cpk)
  • Cost Reduction Achievement

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.

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