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Open nowPosted 151 days ago

封装架构工程师（技术中心）

yesv-desaysv/index444 open roles

Where
Huizhou, Guangdong, Chinese Mainland
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Your applicationOpen now封装架构工程师（技术中心）yesv-desaysv/index · Huizhou, Guangdong, Chinese Mainland

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  3. 25 readersRecruiter, hiring manager, skeptic. Round after round.

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The clock on this job

Early applications get read.

12.3% of postings close within 7 days. Measured by our own scanner across the market. yesv-desaysv/index postings stay open a median of 1 days.

Share of postings closed within
  1. 2.1%1 day
  2. 4.5%3 days
  3. 12.3%7 days
  4. 19.3%14 days
  5. 35.6%30 days
  6. 58.1%60 days
This job: posted 151 days ago

yesv-desaysv/index median: 1 days open

The posting

一、岗位定位 封装架构是芯片 / 封装的顶层总设计师，介于芯片前端、后端、封测、板级硬件、制程工艺之间，负责封装方案定义、技术路线选型、规格统筹、跨部门接口定义，定方案、定规格、定架构、定风险。 二、核心主要工作职责 1. 封装整体架构方案规划 根据芯片功耗、IO 数量、频率、应用场景（消费 / 车载 / 工业）选定封装形态：QFN/BGA/LGA/FC-BGA/Fan-out/SiP/Chiplet 定义单芯片 / 多芯片堆叠 / 并排架构、互连方案（键合 / 倒装 / D2D/TSV） 制定封装外形尺寸、厚度、限高、引脚 / 球阵规划 2. 芯片与封装接口定义 主导Pin 脚分配、电源域划分、信号分组 定义芯片 Pad 规划、扇出路径、差分 / 高速信号布线约束 输出封装 Pin Map、引脚定义规范、电气接口规格 3. 系统与板级协同架构 对接整机 / 板级硬件，定义PCB 适配规则、封装焊盘、钢网、Layout 约束 协调 SI/PI/ 热 / 结构，提前定义高速、电源、散热、机械结构架构规则 评估板级兼容、量产贴片、回流适配性 4. 工艺与供应链选型评估 评估封装厂制程能力、基板层数、线宽线距、凸点、植球、堆叠工艺 做成本、良率、周期、工艺风险对比，敲定最优实现路径 制定封装工艺规格书、制程准入条件 5. 仿真与可靠性架构把控 定义 SI/PI/ 热 / 应力翘曲 / 温循可靠性仿真输入条件与指标 评审仿真报告，从架构层面优化布局、堆叠、材料、结构 制定车规 / 工规可靠性等级、测试项、验收标准 6. SiP/Chiplet 系统集成架构（高阶核心） 多芯片异构集成架构规划：主控 + DDR+Flash+PMIC + 传感器 定义芯粒互连拓扑、中介层 / 基板架构、电源隔离、电磁屏蔽架构 规划 Chiplet 互连协议、物理接口、封装层级分工 7. 跨部门牵头与项目推进 拉通 IC 设计、后端、封测、硬件、结构、工艺、量产多方团队 输出封装规格书、架构方案文档、评审材料、PPT 方案 解决研发全过程封装架构类问题、风险归零、技术决策 8. 技术预研与路线规划 跟踪先进封装技术：Fan-out、2.5D/3D、Chiplet、晶圆级封装 做技术储备、架构预研、平台化 CBB 封装标准建设 沉淀封装通用架构模板、设计规范、Checklist 三、和周边岗位区别 封装 Layout：画图、布线、按规则落地 封装工艺：管制造、制程、产线参数 封装架构：定方案、定规则、定接口、做顶层决策

精通各类封装结构与工艺原理 懂芯片 IO、高速信号、电源完整性、热设计基础 会 Pin 规划、封装架构方案设计、规格输出 跨部门沟通、方案评审、风险评估能力 懂 SiP/Chiplet 优先，车载高可靠性经验加分

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