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Open nowPosted 269 days ago

芯片泛工艺专家（西安） - 芯片研发

ByteDance19,207 open roles

Where
Xi'an, Shaanxi, Chinese Mainland
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Your applicationOpen now芯片泛工艺专家（西安） - 芯片研发ByteDance · Xi'an, Shaanxi, Chinese Mainland

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The clock on this job

Early applications get read.

11.8% of postings close within 7 days. Measured by our own scanner across the market. ByteDance postings stay open a median of 2 days.

Share of postings closed within
  1. 2.1%1 day
  2. 4.4%3 days
  3. 11.8%7 days
  4. 18.5%14 days
  5. 35.5%30 days
  6. 45.1%60 days
This job: posted 269 days ago

ByteDance median: 2 days open

The posting

团队介绍：芯片平台是一个覆盖从逻辑综合到芯片投片、封装设计与仿真、回片测试、量产全流程的统一化芯片设计平台，提供支持多工艺、多项目的自动化设计流程及设计服务。平台整体划分为硅前、硅后、基础资源管理、IP 定制四大业务板块。 通过硅前 - 硅后全流程覆盖、IP 自主定制、基础资源统一管理的架构，芯片平台实现了从 RTL 到量产的端到端设计能力，支持多晶圆厂、多工艺节点，持续通过自动化提效与质量保障，为公司业务提供坚实的支撑。

1、工艺技术评估与优化：负责芯片工艺技术选型、评估与全周期优化，结合SPICE模型特性与PIE工艺参数，提升产品可制造性、电气稳定性及量产良率，解决工艺与设计交叉的核心技术问题； 2、SPICE器件建模与验证：主导SPICE器件模型的定制、校准、验证及迭代优化，覆盖PVT全角落，制定模型测试方案（IV/CV/AC/Noise），负责模型数据收集、TK开发与交付，保障仿真精度与设计收敛，支撑DTCO（设计工艺协同优化）流程落地； 3、PIE工艺整合与管控：主导前道晶圆制造（光刻/刻蚀/薄膜/沉积等）与后道封装测试的全流程PIE工艺整合，制定工艺整合方案与NPI（新产品导入）流程，负责流片、量产爬坡阶段的工艺参数管控、缺陷分析及良率根因定位，通过DOE实验与失效分析（FIB/EMMI）推动工艺优化； 4、设计与工艺协同优化：结合芯片架构、系统需求及PDK规范（DRC/LVS/DFM），从SPICE模型精度、PIE工艺适配性角度优化设计方案，推动设计与工艺协同，提升芯片性能、功耗及可靠性，解决设计端与制造端的工艺适配难题； 5、先进技术跟踪与落地：跟踪技术趋势，评估新工艺、新材料、新模型的可行性，制定技术导入路线图，推动先进技术在产品中的落地应用； 6、供应链协同与工艺改进及技术体系建设：与Foundry、封测厂、EDA厂商紧密合作，同步SPICE模型需求、PIE工艺标准及PDK开发规范，推动供应链端工艺改进、缺陷闭环及制造效率优化，建立快速响应机制解决量产中的工艺问题；同时负责SPICE模型库、PIE工艺规范、PDK应用手册等技术文档的编写与迭代，搭建工艺技术知识库，为团队提供SPICE建模、PIE工艺整合等技术培训，赋能跨部门协作。

1、本科及以上学历，微电子、材料科学、物理、电子工程等相关专业，具备扎实的半导体器件与工艺基础； 2、工作经验：5年及以上半导体行业实战经验，同时具备Foundry工艺开发/量产项目及设计公司产品导入经验；拥有FinFET工艺开发及SPICE器件建模、PIE工艺整合复合经验者优先，主导过先进芯片工艺落地项目者加分； 3、核心技术能力： 1）熟悉SPICE器件建模全流程，熟悉BSIM/PSP等主流模型原理，具备模型校准、验证、TK开发及量产模型问题排查能力，有Foundry模型开发或设计公司模型定制应用经验者优先； 2）熟悉PIE工艺整合核心技能，熟悉前道晶圆制造、后道封装工艺及良率分析方法（WAT/CP/FT数据分析、DOE设计、失效分析），具备工艺参数优化与量产良率提升实战经验； 3）熟悉design platform全流程，熟悉PDK开发与应用（DRC/LVS/DFM规则、PCell、techfile），能联动SPICE模型与PIE工艺优化PDK适配性，具备脚本开发能力（Python/TCL/Skill）者加分； 4、先进技术经验：具备3D IC、Chiplet、CoWoS/Fan-out等先进封装技术相关经验，熟悉TSV、混合键合等工艺者优先，能结合业务需求提供先进技术解决方案； 5、综合能力：具备较强的问题分析与解决能力，能高效处理流片及量产中的工艺、模型类复杂问题；拥有优秀的跨团队协作能力，可顺畅对接Foundry、封测厂、设计团队及EDA厂商；英语可作为工作语言，能独立对接国际化供应链及技术文档。

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