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Open nowPosted 82 days ago

芯片物理实现与系统集成工程师（芯片平台） - 芯片研发

ByteDance19,208 open roles

Where
Shanghai, Chinese Mainland
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Your applicationOpen now芯片物理实现与系统集成工程师（芯片平台） - 芯片研发ByteDance · Shanghai, Chinese Mainland

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The clock on this job

Early applications get read.

12.1% of postings close within 7 days. Measured by our own scanner across the market. ByteDance postings stay open a median of 2 days.

Share of postings closed within
  1. 2.1%1 day
  2. 4.5%3 days
  3. 12.1%7 days
  4. 19.1%14 days
  5. 35.6%30 days
  6. 52.7%60 days
This job: posted 82 days ago

ByteDance median: 2 days open

The posting

团队介绍：字节芯片研发团队目前工作主要集中在芯片设计环节，主要围绕字节自身业务展开芯片探索，为字节多项业务的专用场景定制硬件优化，设计多款基于先进半导体工艺的云端复杂芯片，以期提升性能、降低成本。早期若干芯片项目已经进入到量产部署阶段，有多次一版成功的投片经历，所用工艺包含多个主流的先进工艺节点。与基础设施各团队之间工作的整体协同，能更容易和更好地发挥芯片研发的价值。

1、负责ASIC/CPU芯片的中后端设计，涵盖物理设计、DFT、综合STA和封装SIPI等领域相关工作； 2、DFT方向：负责SoC芯片中的DFT实现相关工作，包括Scan、MBIST、ATPG、Boundary Scan等内容，配合上下游团队完成芯片设计过程中DFT相关的Timing/Power-IR分析和收敛等工作，流片后完成向量调试、优化、覆盖率优化等ATE测试相关问题； 3、综合集成方向：与其他团队合作完成SoC芯片Clock/Reset方案、Low Power方案，开发芯片的时序约束与低功耗约束，负责SoC芯片的综合、形式验证、时序分析，推动PPA提升，负责STA signoff、Power/Low Power signoff，优化并推动signoff方法学，负责芯片各类Timing check，成为流片前Timing把关人； 4、封装仿真方向：负责自研芯片全流程封装相关工作，涵盖封装方案选型与定制，完成封装设计并保障交付，开展SI&PI仿真确保信号与电源完整性，进行封装热和应力仿真提前预判并优化散热、可靠性风险，同时负责封装工艺和基板工艺开发，对接上下游厂商保障设计可制造性； 5、物理设计方向：负责先进工艺数字芯片从门级网表到GDSII的芯片后端物理实现全流程，负责PPA优化、芯片STA收敛、物理验证（PV）、IR/EM等芯片后端signoff，具备新技术与流程探索能力，协助开发优化In-house EDA工具与后端设计流程。

1、2027届获得本科及以上学历，计算机/电子/微电子/通信/半导体封装/材料/机械/自动化等相关专业优先； 2、DFT方向：熟练使用DFT EDA工具，掌握DFT原理和方法，具备良好的学习能力、团队合作精神和认真负责的工作态度； 3、综合集成方向： 1）对综合、STA、低功耗等方法学具备一定的知识，有相关项目经验者优先； 2）了解Device和Compact Model，熟悉SPICE Simulation者优先； 4、封装仿真方向：熟练掌握信号完整性及电源完整性的理论知识；熟悉并了解FCBGA、FCCSP、WLCSP、WLBGA、MCM等封装类型的工艺流程和设计要点；理解封装各项性能指标及关键点； 5、物理设计方向： 1）掌握数字电路基础知识，熟练使用主流后端工具，具备一定脚本能力； 2）熟悉并清晰理解后端设计流程及相关概念（Floorplan/CTS/STA等）； 3）对先进工艺DTCO方面有深入理解，具备一定AI/EDA方面专业知识（加分项）。

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